TechniStrip MLO-07 - 5.00 l - MOS
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TechniStrip® MLO07
DMSO-based Stripper
General Information
TechniStrip® MLO 07 is a highly efficient positive and negative tone photoresist remover used for IR, III/V, MEMS, Photonic, TSV mask, solder bumping and hard disk stripping applications. TechniStrip® MLO 07 is developed to address high dissolution performance and high material compatibility on Cu, Al, Sn/Ag, Alu¬mina and common organic substrates.
Product Properties
- Flashpoint: 94°C
- Water Solubility: Fully miscible
- Boiling point: 189°C
- Density (at 20°C): 1.093 g/cm3
Compatibility
- Metals: no attack on Al, Cu, Ni, Ta, TaN, Ti, TiN, TiW, Au, Ag, Sn
- Substrates: Si, SiO2
Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.
Main Features
- Improved performance over NMP in many applications
- Provides dissolution for many positive resists
- High material compatibility on Cu, Al, Sn, Ag, alumina, magnetic alloys and organic substrates
- Ideally suited for gold and aluminum metal lift-off
- Formulated to minimize the formation of metal fragments during the lift-off process
Some Applications
- Metal Lift-Off Process
Further Information
MSDS:
Safety Data Sheet TechniStrip MLO-07 (MOS) english
Sicherheitsdatenblatt TechniStrip MLO-07 (MOS) german
TDS:
Technical Data Sheet TechniStrip MLO-07 (MOS) english
Specs:
Specs TechniStrip MLO-07 (MOS)
Application Notes:
Photoresist Removal english
Fotolack entfernen german
| Bottle size: | 5.00 l |
|---|---|
| Compatible Substrates: | Si, SiO2 |
| Purity: | MOS |
| Selectivity (no attack on): | Ag, Al, Au, Cu, Ni, Sn, Ta, TaN, Ti, TiN, TiW |
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