MicroChemicals GmbH

TI 35 E - 5.00 l

TI 35E is an image reversal resist for wet chemical applications.
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Product number: 1035005
Manufacturer: MicroChemicals GmbH
Product information "TI 35 E - 5.00 l"

TI 35E Photoresist

Image Reversal Resist

 

General Information

TI 35E for 2.5 - 5 µm Resist Film Thickness (g -, H - and I-line)
TI 35E is an image reversal resist with optimised adhesion, however compared with TI 35ESX, a lower sof¬tening temperature. As a result it is more suited for wet-chemical etching processes.

Product Properties
  • Optimized resist adhesion to all common substrate materials
  • Broad process parameter window for stable and reproducible litho-processes
  • Compatible with all common strippers (e. g. with AZ® 100 Remover, organic solvents, or aqueous alkaline)
  • g-, h- and i-line sensitive (approx. 320 - 440 nm)
  • Resist film thickness range approx. 2.5 - 5 µm
Developers

If metal ion containing developers can be used, the KOH-based AZ® 400K in a 1:4 dilution (for higher resist film thicknesses 1:3.5 - 1:3 diluted possible) is a suited developer.
If metal ion free developers have to be used, we recommend the TMAH-based AZ® 2026 MIF developer (undiluted).

Removers

For non cross-linked resist films the AZ® 100 Remover, DMSO or other common organic solvents cab be used as stripper. If the resist film is crosslinked (e. g. by high temperature steps > 140°C, during plasma processes such as dry etching, or during ion implantation), we recommend the NMP-free TechniStrip P1316 as remover. AZ® 920 Remover can be a good choice as well, in case of harsh treated, hard to remove resist residuals.

Thinning/ Edge Bead Removal

We recommend for thinning and edge bead removal the products AZ® EBR Solvent or PGMEA.

Further Information

MSDS:
Safety Data Sheet TI 35E Photoresist english
Sicherheitsdatenblatt TI 35E Fotolack german

TDS:
Technical Data Sheet TI 35E Photoresist english

Application Notes:
Further Information about Photoresist Processing

Chemically amplified: no
Film thickness: 1.0 - 1.8 µm
Film thickness range: medium (1.6 - 5.0µm), thin (< 1.5µm)
High thermal stability: yes
Mode: image reversal, positive
Optimized for: dry etching, wet etching