NB Semiplate Sn 100 - 1.00 l
NB Semiplate SN 100
Tin Plating Solution
General Information
NB Semiplate SN 100 is a high-purity electroplating process which produces fine-grained, matte, pure tin deposits. It is especially formulated for use in the fabrication of circuit patterns and bumps on semiconductor wafers. The process contains no fluoborates or formaldehyde and is operated with soluble anodes.
NOTE: NB Semiplate SN 100 is a ready-to-use product. It is not necessary to add other materials for the initially start of the application. Over time, it may be necessary depending on the electrolyte and application to add additives (see data sheet). With adjusted photoresist processing, the NB Semiplate SN 100 is compatible with common AZ®- and TI resists.
Further Information
MSDS:
Safety Data Sheet NB Semiplate SN 100 english
Sicherheitsdatenblatt NB Semiplate SN 100 german
TDS:
Technical Data Sheet NB Semiplate SN 100 english
Application Notes:
Instruction NBT Sample Service for Plating Baths english
Anleitung NBT Probenservice für Galvanikbäder german
Plating Theory english
Galvanik Theorie german
Plating and Photoresist english
Galvanik und Fotolacke german
| Plating Solution: | Sn |
|---|---|
| Resist compatible: | yes |
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