NB Semiplate Ni 100 - 1.00 l - EUD/EVE!
NB Semiplate NI 100
Nickel Plating Solution
General Information
NB Semiplate NI 100 is a nickelsulfamate electroplating process that produces a pure, ductile, fine-grained, semi-bright low stress nickel deposit required to meet the needs of the semiconductor industry for quality assured chemistry. NB Semiplate NI 100 is manufactured to meet the requirements associated with the electroforming of micro patterned wafers (Micro System Technology). The NB Semiplate NI 100 process contains an anode activating agent in controlled amounts to enhance anode corrosion and prevent anode passivation. Deposit properties are easy to control and maintain.
NB Semiplate NI 100
NOTE: NB Semiplate NI 100 is a ready-to-use product. It is not necessary to add other materials for the initially start of the application. Over time, it may be necessary depending on the electrolyte and application to add additives (see data sheet). With adjusted photoresist processing, the NB Semiplate NI 100 is compatible with common AZ®- and TI resists.
Product Properties
- Pure nickel depositions
- High ductile plating
- Fine grained, satin dull deposition
- Controllable inner stress of the deposition up to 7000 µm
- No anode passivation
- High hardness, controllable
- Good throwing power
Further Information
MSDS:
Safety Data Sheet NB Semiplate NI 100 english
Sicherheitsdatenblatt NB Semiplate NI 100 german
TDS:
Technical Data Sheet NB Semiplate NI 100 english
Application Notes:
Instruction NBT Sample Service for Plating Baths english
Anleitung NBT Probenservice für Galvanikbäder german
Plating Theory english
Galvanik Theorie german
Plating and Photoresist english
Galvanik und Fotolacke german
| Plating Solution: | In |
|---|---|
| Resist compatible: | yes |
Related products
