NB Semiplate Cu 100 - 1.00 l
NB Semiplate CU 100
Copper Plating Solution
General Information
The NB Semiplate CU 100 process is an acid copper plating formulation engineered for wafer plating applications including copper bump plating, interconnects for VLSI/ULSI or MEMS. The NB Semiplate CU 100 process provides excellent throwing power, improved leveling characteristics, ductile low stress deposits and offers unique flexibility in its operation.
NB Semiplate CU 100
NOTE: NB Semiplate CU 100 is a ready-to-use product. It is not necessary to add other materials for the initially start of the application. Over time, it may be necessary depending on the electrolyte and application to add additives (see data sheet). With adjusted photoresist processing, the NB Semiplate CU 100 is compatible with common AZ®- and TI resists.
Further Information
MSDS:
Safety Data Sheet NB Semiplate CU 100 english
Sicherheitsdatenblatt NB Semiplate CU 100 german
TDS:
Technical Data Sheet NB Semiplate CU 100 english
Application Notes:
Instruction NBT Sample Service for Plating Baths english
Anleitung NBT Probenservice für Galvanikbäder german
Plating Theory english
Galvanik Theorie german
Plating and Photoresist english
Galvanik und Fotolacke german
| Plating Solution: | Cu |
|---|---|
| Resist compatible: | yes |
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