NB Semiplate Au 100 - 1.00 l
NB Semiplate AU 100 AS
Gold Plating Solution
General Information
NB Semiplate AU 100 AS is an alkaline, non-cyanide electroplating formulation based on arsenic grain refiner which produces a bright, ductile deposit. In comparison with other gold plating processes, the NB Semiplate AU 100 AS electrolyte demonstrates exceptional throwing power that results in good coverage of recesses, holes and hollows of parts of complex geometry. Deposits from the NB Semiplate AU 100 process also exhibit the unique ability to build brightness with increasing thickness. NB Semiplate AU 100 AS deposits have main applications in MEMS processing.
NB Semiplate AU 100
NOTE: NB Semiplate AU 100 AS is a ready-to-use product. It is not necessary to add other materials for the initially start of the application. Over time, it may be necessary depending on the electrolyte and application to add additives (see data sheet). With adjusted photoresist processing, the NB Semiplate AU 100 AS is compatible with common AZ®- and TI resists.
Product Properties
- Purity: 99.9%
- Hardness: approx. 130 to 190 HV0,020
- Contact Resistance: 0.3 mW (measured by cross-wire method with 200 gram load.)
- Deposit weight for 2.5 microns: 31.6 mg/in2 (4.9 mg/cm2)(100 µin)
Further Information
MSDS:
Safety Data Sheet NB Semiplate AU 100 AS english
Sicherheitsdatenblatt NB Semiplate AU 100 AS german
TDS:
Technical Data Sheet NB Semiplate AU 100 AS english
Application Notes:
Instruction NBT Sample Service for Plating Baths english
Anleitung NBT Probenservice für Galvanikbäder german
Plating Theory english
Galvanik Theorie german
Plating and Photoresist english
Galvanik und Fotolacke german
| Plating Solution: | Au |
|---|---|
| Resist compatible: | yes |
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