Fused silica JGS2 wafer 6 inch 700 um DSP

Fused Silica wafer 700 µm
Quantity Unit price
To 4
€74.00*
To 9
€61.00*
To 24
€54.40*
To 49
€48.00*
To 99
€44.00*
To 199
€41.00*
From 200
€38.00*
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Product number: WUS60700250X0000SNN1
Product information "Fused silica JGS2 wafer 6 inch 700 um DSP"

Fused silica JGS2 wafer 6 inch, thickness = 700 ± 25 µm, 2-side polished, TTV < 10 µm, S/D 40/20, Bow < 25 µm, Warp < 30 µm, 1 SEMI Flat

Diameter (round): 6 inch
Material: Fused Silica
Surface: 2-side polished
Thickness: 501 - 700 µm