Fused silica wafer 2 inch 700 um DSP

Fused Silica wafer 700 µm

Quantity	Unit price
To 49	€8.00*
To 99	€7.50*
To 199	€7.10*
To 299	€6.80*
To 399	€6.60*
To 599	€6.20*
From 600	€5.80*

Prices excl. VAT plus shipping costs

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Product number: WUS20700250X0000XNN1

Product information "Fused silica wafer 2 inch 700 um DSP"

Fused silica JGS2 wafer 2 inch, thickness = 700 ± 25 µm, 2-side polished, TTV < 10 µm, top side Ra < 1 nm, S/D < 40/20, C shape CNC edge grounding, NO FLAT

Diameter (round):	2 inch
Material:	Fused Silica
Surface:	2-side polished
Thickness:	501 - 700 µm