Fused silica JGS1 wafer 2 inch 500 um DSP

Fused Silica wafer 500 µm
Quantity Unit price
To 19
€16.00*
To 49
€14.00*
To 99
€12.00*
To 299
€11.00*
From 300
€10.00*
Wafer
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Product number: WUS20500250X0000SNN2
Product information "Fused silica JGS1 wafer 2 inch 500 um DSP"

Fused silica JGS1 wafer 2 inch, thickness = 500 ± 25 µm, 2-side polished, TTV < 10 µm, 1 SEMI Flat, !! Units of 10 wafers per cassette

Diameter (round): 2 inch
Material: Fused Silica
Surface: 2-side polished
Thickness: 401 - 500 µm