Fused silica JGS2 wafer 3 inch 320 um DSP

Fused Silica wafer 320 µm
Quantity Unit price
To 4
€28.00*
To 9
€22.00*
To 24
€17.00*
To 49
€12.00*
To 99
€11.00*
To 199
€10.00*
From 200
€9.00*
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Product number: WUA30320100X0000SNN1
Product information "Fused silica JGS2 wafer 3 inch 320 um DSP"

Fused silica JGS2 wafer 3 inch, thickness = 320 ± 10 µm, 2-side polished, TTV < 10 µm

Diameter (round): 3 inch
Material: Fused Silica
Surface: 2-side polished
Thickness: 301 - 400 µm