TechniStrip NF52 - 5.00 l - MOS
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TechniStrip™ NF52
Highly Effective Remover
General Information
TechniStrip™ NF52 is a highly effective remover for negative resists (liquid resists as well as dry films). The intrinsic nature of the additives and solvent make the blend totally compatible with metals used throughout the BEOL interconnects to WLP bumping applications.
Product Properties
- Flashpoint: 90°C
- Viscosity (20°C): < 2cP
- Water Solubility: Totally miscible
- Boiling point: 189°C
- Density (at 20°C): 1.08 g/cm3
Compatibility
- Metals: no attack on Al, Cu, Ni, Ta, TaN, Ti, TiN, TiW, Ag, Sn
- Substrates: Si, SiO2
Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.
Main Features
- Very high stripping rate, >10µm/min
- Great resin dissolution efficiency of dry film
- Bath life up to 72 hours @ 70°C
- Total metal compatibility, <2A/min @60°C
- Complete water miscibility
Further Information
MSDS:
Safety Data Sheet TechniStrip NF52 (MOS) english
Sicherheitsdatenblatt TechniStrip NF52 (MOS) german
TDS:
Technical Data Sheet TechniStrip NF52 (MOS) english
Specs:
Specs TechniStrip NF52 (MOS)
Application Notes:
Photoresist Removal english
Fotolack entfernen german
| Compatible Substrates: | Si, SiO2 |
|---|---|
| Purity: | MOS |
| Selectivity (no attack on): | Ag, Al, Cu, Ni, Sn, Ta, TaN, Ti, TiN, TiW |
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