TechniStrip NF26 - 5.00 l - MOS
TechniStrip™ NF26
Dry Film Remover
General Information
TechniStrip™ NF26 is a highly effective negative tone photoresist remover used mainly for TSV mask and solder bumping applications.
Developed to address laminated photo-resins (dry-film resists) and liquid resins, the novel cleaning formulation TMAH-based showed high dissolution performance compared to standard TMAH-based blends. Additional advantages of the TechniStrip™ NF26 are its very high material compatibility compared to standard TMAH-based solutions. The intrinsic nature of the additives and solvent make the blend totally compatible with metals used throughout the BEOL interconnects to WLP bumping applications.
Product Properties
- Flashpoint: 90°C
- Viscosity (20°C): < 2cP
- Water Solubility: Totally miscible
- Boiling point: 189°C
- Density (at 20°C): 1.02 g/cm3
Compatibility
- Metals: no attack on Al, Cu, Ni, Ta, TaN, Ti, TiN, TiW, Ag, Sn
- Substrates: Si, SiO2
Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.
Main Features
- Very high stripping rate, > 10µm/min
- Great resin dissolution efficiency of dry film
- Bath life up to 72 hours @ 70°C
- Total metal compatibility, < 2 A/min @ 60°C
- Complete water miscibility
Further Information
MSDS:
Safety Data Sheet TechniStrip NF26 (MOS) english
Sicherheitsdatenblatt TechniStrip NF26 (MOS) german
TDS:
Technical Data Sheet TechniStrip NF26 (MOS) english
Specs:
Specs TechniStrip NF26 (MOS)
Application Notes:
Photoresist Removal english
Fotolack entfernen german
| Bottle size: | 5.00 l |
|---|---|
| Compatible Substrates: | Si, SiO2 |
| Purity: | MOS |
| Selectivity (no attack on): | Ag, Al, Cu, Ni, Sn, Ta, TaN, Ti, TiN, TiW |
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