TechniEtch TBR 19 Concentrate - 2.50 l - MOS
Available, ready for dispatch in approx.: 3-4 Tage
TechniEtch™ TBR19 Concentrate
Ti, TiW and TiN Etchant
General Information
TechniEtch™ TBR19 is a low undercut Ti etch chemistry concentrate for Cu bump pillars for self-mixing. TechniEtch™ TBR19 concentrate is compatible with most under bump metallization (UBM) and copper pillar integration materials such as Cu, Al, Ni and alloys, glass, organic substrate and most plastics like polypropylene, HDPE, PFA, PTFE Kalrez, PEEK, PE. The etching rate at 50°C is around 1000 A/min.
TBR19 (150°C 180s underetch smaller than 500nm)
Product Properties
- High selectivity
- Significant reduction of undercut compared to conventional SC1 and HF
- Long bath life
- Tunable etch rate
Selectivity
TechniEtch™ TBR19 is compatible/etches selective to following materials:
- Metals: no attack on Cu, Al, Ni, Sn
- Metals: attack on TiN, TiW, Ti, SnPd
Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.
Further Information
MSDS:
Safety Data TechniEtch TBR 19 (MOS) english
Sicherheitsdatenblatt TechniEtch TBR 19 (MOS) german
TDS:
Technical Data Sheet TechniEtch TBR 19 (MOS) english
Mixing Technical Data Sheet TechniEtch TBR 19 (MOS) english
Specs:
Specs TechniEtch TBR 19 (MOS)
Application Notes:
Wet Etching english
Nasschemisches Ätzen german
Wet Etching Metals english
Nasschemisches Ätzen von Metallen german
| Bottle size: | 2.50 l |
|---|---|
| Purity: | MOS |
| Selectivity (attacked): | SnPd, Ti, TiN, TiW |
| Selectivity (no attack on): | Al, Cu, Ni, Sn |
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