TechniEtch CN10 Concentrate - 2.50 l - MOS - EVE/EUD!

TECHNIC France

TechniEtch™ CN10 is a copper and nickel etchant, which is a mixture of nitric- and phosphoric acid.

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Product number: TPCN1025

Manufacturer: TECHNIC France

Product information "TechniEtch CN10 Concentrate - 2.50 l - MOS - EVE/EUD!"

TechniEtch^™ CN10

Copper and Nickel Etchant

General Information

TechniEtch^™ CN10 is a copper and nickel etchant, which is a mixture of nitric- and phosphoric acid. The etching process should be carried out with an addition of 8-16 % Hydrogenperoxide (30 %). At 25° C the etching rate is approx. 0.3-0.4 µm per minute. Without the Addition of Hydrogenperoxide the etching rate is significantly lower and less homogenous.

TechniEtch CN10 (90 s RT Cu seed removal)

TechniEtch CN10 (90 s RT Cu seed removal)

Product Properties

Better process controllability/reliability
High stability even in presence of metal contamination

Selectivity

TechniEtch^™ CN10 is compatible/etches selective to following materials:

Metals: no attack on Ti, TiN
Metals: attack on Cu, Ni

Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.

Further Information

MSDS:
Safety Data TechniEtch^™ CN10 (MOS) english
Sicherheitsdatenblatt TechniEtch^™ CN10 (MOS) german

TDS:
TF Technical Data Sheet TechniEtch^™ CN10 (MOS) english
MC Technical Data Sheet TechniEtch^™ CN10 (MOS) english
Mixing TechniEtch^™ CN10 (MOS) english

Specs:
Specs TechniEtch^™ CN10 (MOS)

Application Notes:
Wet Etching english
Nasschemisches Ätzen german
Wet Etching Metals english
Nasschemisches Ätzen von Metallen german

Further Information about Processing

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