TechniEtch CN10 Concentrate - 2.50 l - MOS - EVE/EUD!
Available, ready for dispatch in approx.: 3-4 Tage
TechniEtch™ CN10
Copper and Nickel Etchant
General Information
TechniEtch™ CN10 is a copper and nickel etchant, which is a mixture of nitric- and phosphoric acid. The etching process should be carried out with an addition of 8-16 % Hydrogenperoxide (30 %). At 25° C the etching rate is approx. 0.3-0.4 µm per minute. Without the Addition of Hydrogenperoxide the etching rate is significantly lower and less homogenous.
TechniEtch CN10 (90 s RT Cu seed removal)
Product Properties
- Better process controllability/reliability
- High stability even in presence of metal contamination
Selectivity
TechniEtch™ CN10 is compatible/etches selective to following materials:
- Metals: no attack on Ti, TiN
- Metals: attack on Cu, Ni
Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.
Further Information
MSDS:
Safety Data TechniEtch™ CN10 (MOS) english
Sicherheitsdatenblatt TechniEtch™ CN10 (MOS) german
TDS:
TF Technical Data Sheet TechniEtch™ CN10 (MOS) english
MC Technical Data Sheet TechniEtch™ CN10 (MOS) english
Mixing TechniEtch™ CN10 (MOS) english
Specs:
Specs TechniEtch™ CN10 (MOS)
Application Notes:
Wet Etching english
Nasschemisches Ätzen german
Wet Etching Metals english
Nasschemisches Ätzen von Metallen german
| Bottle size: | 2.50 l |
|---|---|
| Purity: | MOS |
| Selectivity (attacked): | Cu, Ni |
| Selectivity (no attack on): | Ti, TiN |
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