TechniClean CA25 - 5.00 l - MOS
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TechniClean™ CA25
Post Etch Residue (PER) Remover
General Information
TechniClean™ CA25 is a semi-aqueous proprietary blend formulated to address post etch residue (PER) removal for all interconnect and technology nodes. Extremely efficient in the rapid and selective removal of organo-metal oxides from Al, Cu, Ti, TiN, W and Ni.
Product Properties
- Flashpoint: > 120°C
- Water Solubility: Totally miscible
- Viscosity (20°C): < 3 cP
- Boiling point: 100°C
- Density (at 20°C): 1.041 g/cm3
Compatibility
It removes organo-metal oxides from:
- Metals: no attack on Al, Cu, Ti, TiN, W, Ni
Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.
Main Features
- Unmatched PER cleaning versatility
- High efficiency at low temperature
- No intermediary rinse
- Low environmental impact (fluoride, amine, hydroxylamine and catechol free)
- Cost efficiency
Further Information
MSDS:
Safety Data Sheet TechniClean™CA25 (MOS) english
Sicherheitsdatenblatt TechniClean™CA25 (MOS) german
TDS:
Technical Data Sheet TechniClean™CA25 (MOS) english
Specs:
Specs TechniClean™CA25 (MOS)
Application Notes:
Photoresist Removal english
Fotolack entfernen german
| Bottle size: | 5.00 l |
|---|---|
| Purity: | MOS |
| Selectivity (no attack on): | Al, Cu, Ni, Ti, TiN, W |
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