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Square Fused silica JGS2 wafer 30 x 30 mm 200 um DSP

Fused Silica wafer 200 µm

Product information "Square Fused silica JGS2 wafer 30 x 30 mm 200 um DSP"

Square Fused silica JGS2 wafer piece (30 x 30 mm), thickness = 200 ± 25 µm, 2-side polished

Material: Fused Silica
Rectangular Size: 21 - 50 mm
Surface: 2-side polished
Thickness: 100 - 200 µm