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Si + wet SiO2 wafer 4 inch 525 um (100) SSP B-doped

Prime Si + SiO2 (wet) (500 nm) wafer 525 µm 100

Product information "Si + wet SiO2 wafer 4 inch 525 um (100) SSP B-doped"

Prime Si + dry/wet/dry SiO2 wafer 4 inch, thickness = 525 ± 25 µm, (100), 1-side polished, p-type (Boron) TTV < 10 µm, 1 - 10 Ohm cm, 500 nm SiO2

Diameter (round): 4 inch
Material: Si + SiO2 (wet) (500 nm)
Orientation: 100
Quality: Prime
Resistivity: 1 - 10 Ohm cm
SiO2 thickness: 401 - 500 nm
Surface: 1-side polished
Thickness: 501 - 700 µm