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Si + dry SiO2 wafer 4 inch 525 um (100) SSP B-doped

Prime Si + SiO2 (dry) (90 nm) wafer 525 µm 100

Product information "Si + dry SiO2 wafer 4 inch 525 um (100) SSP B-doped"

Prime Si + dry SiO2 wafer 4 inch, thickness = 525 ± 25 µm, (100), 1-side polished, p-type (Boron) TTV < 5 µm, 0.001 - 0.01 Ohm cm, 90 nm SiO2