Skip to main content

Si + dry SiO2 wafer 4 inch 525 um (100) SSP B-doped

Prime Si + SiO2 (dry) (290 nm) wafer 525 µm 100

Product information "Si + dry SiO2 wafer 4 inch 525 um (100) SSP B-doped"

Prime Si + dry SiO2 wafer 4 inch, thickness = 525 ± 20 µm, (100), 1-side polished, p-type (Boron), TTV < 5 µm, Bow/Warp < 30 µm, 0.001 - 0.005 Ohm cm, 290 nm SiO2 (+/- 7 %), particles: <10 @ 0.5 µm