Skip to main content

Si + dry SiO2 wafer 4 inch 525 um (100) SSP As-doped

Prime Si + SiO2 (dry) (200 nm) wafer 525 µm 100

Product information "Si + dry SiO2 wafer 4 inch 525 um (100) SSP As-doped"

Prime Si + dry SiO2 wafer 4 inch, thickness = 525 ± 25 µm, (100), 1-side polished, n-type (Arsenic) TTV < 10 µm, 0.001 - 0.005 Ohm cm, 200 nm SiO2