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Si + dry SiO2 wafer 3 inch 200 um (100) SSP B-doped

Prime Si + SiO2 (dry) (300 nm) wafer 200 µm 100

Product information "Si + dry SiO2 wafer 3 inch 200 um (100) SSP B-doped"

Prime Si + dry SiO2 wafer 3 inch, thickness = 200 ± 25 µm, (100), 1-side polished, p-type (Boron), 1 - 10 Ohm cm, 300 nm SiO2, 2 SEMI flats