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Si + dry SiO2 wafer 2 inch 279 um (100) SSP B-doped

Prime Si + SiO2 (dry) (50 nm) wafer 279 µm 100

Product information "Si + dry SiO2 wafer 2 inch 279 um (100) SSP B-doped"

Prime Si + dry SiO2 wafer 2 inch, thickness = 279 ± 20 µm, (100), 1-side polished, p-type (Boron) TTV < 10 µm, 0.001 - 0.05 Ohm cm, 50 +/- 30 nm SiO2

Diameter (round): 2 inch
Material: Si + SiO2 (dry) (50 nm)
Orientation: 100
Quality: Prime
Resistivity: 0 - 0.01 Ohm cm
SiO2 thickness: 0 - 100 nm
Surface: 1-side polished
Thickness: 201 - 300 µm