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Si + Si3N4 wafer 4 inch 525 um (100) DSP B-doped

Prime Si + Si3N4 (40 nm) wafer 525 µm 100

Product information "Si + Si3N4 wafer 4 inch 525 um (100) DSP B-doped"

Prime Si + Si3N4 wafer 4 inch, thickness = 525 ± 25 µm, (100), 2-side polished, p-type (Boron), TTV < 5 µm, 1 - 10 Ohm cm, 40 nm low-stress Si3N4

Diameter (round): 4 inch
Material: Si + Si3N4 (40 nm)
Orientation: 100
Quality: Prime
Resistivity: 1 - 10 Ohm cm
Si3N4 thickness: 0 - 100 nm
Surface: 2-side polished
Thickness: 501 - 700 µm