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Si + Si3N4 wafer 4 inch 380 um (100) DSP B-doped

Prime Si + Si3N4 (50 nm) wafer 380 µm 100

Product information "Si + Si3N4 wafer 4 inch 380 um (100) DSP B-doped"

Prime Si + Si3N4 (low-stress) wafer 4 inch, thickness = 380 ± 15 µm, (100), 2-side polished, p-type (Boron). TTV < 5 µm, 1 - 10 Ohm cm, 50 nm low-stress LPCVD Si3N4 on both sides

Diameter (round): 4 inch
Material: Si + Si3N4 (50 nm)
Orientation: 100
Quality: Prime
Resistivity: 1 - 10 Ohm cm
Si3N4 thickness: 0 - 100 nm
Surface: 2-side polished
Thickness: 301 - 400 µm