Skip to main content

Si + Si3N4 wafer 3 inch 381 um (100) DSP B-doped

Prime Si + Si3N4 (0 nm) wafer 381 µm 100

Product information "Si + Si3N4 wafer 3 inch 381 um (100) DSP B-doped"

Prime Si + Si3N4 (low-stress) wafer 3 inch, thickness = 381 ± 25 µm, (100), 2-side polished, p-type (Boron) TTV < 10 µm, 1 - 10 Ohm cm, 1000 nm low-stress Si3N4