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Si + Si3N4 wafer 4 inch 500 um (100) DSP
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€44.00*
WNS40500250X0000S051
Fused Silica JGS2 + Si3N4 wafer 4 inch, thickness = 500 ± 25 µm, (100), 2-side polished, + 50 nm low-stress LPCVD Si3N4 on both sides