AZ® 100 Remover Universal Photoresist Stripper   General Information AZ®100 Remover is based on solvent and amine (alkaline). AZ®100 Remover is used for photoresist stripping with low attack to aluminium. Low hazard is achieved by the use of ethanol amine. Low evaporation rate allows the use at elevated temperatures (up to 80°C), high efficiency (>3000 wafer per litre) helps saving costs. Where attack to aluminium is of no concern, it may even be diluted with water. AZ®100 Remover is not compatible with AZ® nLof 2070 (AZ® nLof 2000 series) resists and other heavily cross linked resists. Product Properties Density (at 25°C): 0.955 kg/l Color (Alpha): max. 20 Flashpoint (AP): 72°C Normality (potentiometric): 3.1 mol/l Boiling range: 159-194°C Further Information MSDS: Safety Data Sheet AZ® 100 Remover english Sicherheitsdatenblatt AZ® 100 Remover german TDS: Technical Data Sheet AZ® 100 Remover english Application Notes: Photoresist removal english Fotolack entfernen german

AZ® Remover 910 Organic Solvent Based Remover   General Information AZ® Remover 910 is designed to strip and dissolve positive and negative-tone, chemically amplified and DNQ/Novolak resists. It is a solvent based product that contains acids and is therefore acidic. The formulation is EH&S friendly, it contains no NMP, DMAC, DMSO and no TMAH and it is amine free. It is especially suited for our cross-linking negative resists such as AZ® nLof 2070, 2035 and 2020, the AZ® nLof 5110 and the AZ® 15nXT series resists. Compatibility It is suitable for processes where sensitive metals and other materials are exposed. It shows low etch rates on: Al, Cu, Ti, W, TiW, TiN, Sn, Ni Si, SiO2 Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details. Further Information MSDS: Safety Data Sheet AZ® Remover 910 english Sicherheitsdatenblatt AZ® Remover 910 german TDS: Technical Data Sheet AZ® Remover 910 english Application Notes: Photoresist Removal english Entfernen von Fotolack german

AZ® Remover 920 Organic Solvent Based Remover   General Information AZ® Remover 920 is designed for fast delamination and dissolution of photoresist patterns while maintaining broad compatibility with device substrates and metal films. Merck’s proprietary solvent and additive blend is environmentally friendly and fully compliant with the European Union’s REACH regulatory code. Compatible with most AZ® positive resists (complete dissolution) and most AZ® negative resists (dissolution or delamination depending on degree of cross-linking). Product Properties Flashpoint: 84.4°C Viscosity (20°C): 1.84 cSt Boiling point: 188°C Density (at 25°C): 1.084 g/cm3 Compatibility Metals: no attack on Al, Cu, Ti, W, TiW, TiN, Sn, Ni Substrates: Si, SiO2, GaAs Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details. Main Features Fast delamination of photoresist patterns Broad compatibility Environmentally friendly Some Applications Bulk Photoresist Removal Metal Lift-off Lithography Cu Pillar Metallization Cleans RDL Metallization Cleans Delamination of Heavily Cured Photoresist Patterns & Organic Residues Further Information MSDS: Safety Data Sheet AZ® Remover 920 english Sicherheitsdatenblatt AZ® Remover 920 german TDS: Technical Data Sheet AZ® Remover 920 english Application Notes: Photoresist Removal english Entfernen von Fotolack german

DMSO Dimethyl Sulfoxide   General Information Due to its low vapour pressure and its water solubility, DMSO is an excellent stripper for resists respectively Lift-off media and is a non-toxic substitute for the NMP, which has been classified as toxic since a while. The optional addition of Cyclopentanone or MEK increases the performance of the stripper for certain applications and significantly lowers the melting point of pure DMSO. NOTE: The solvent DMSO (dimethyl sulfoxide) has a melting point just below room temperature, so it can possi¬bly freeze in storage in cooler rooms. Thawing may require several days, but afterwards the product can still be used as it is. For more details please download the info letter. Product Properties Density: 1.1 g/cm3 Melting point: 18°C Boiling point: 189°C Flash point: 87°C Vapour pressure @ 20°C: 0.56 hPa   DMSO Molecule Further Information MSDS: Safety Data Sheet DMSO (ULSI) english Sicherheitsdatenblatt DMSO (ULSI) german Specs: Specs DMSO (ULSI) Application Notes: Solvents: Theory and Application english Lösemittel: Theorie und Anwendung german Photoresist Removal english Fotolack entfernen german Further Information about Processing

TechniCleanTM CA25 Post Etch Residue (PER) Remover   General Information TechniCleanTM CA25 is a semi-aqueous proprietary blend formulated to address post etch residue (PER) removal for all interconnect and technology nodes. Extremely efficient in the rapid and selective removal of organo-metal oxides from Al, Cu, Ti, TiN, W and Ni. Product Properties Flashpoint: > 120°C Water Solubility: Totally miscible Viscosity (20°C): < 3 cP Boiling point: 100°C Density (at 20°C): 1.041 g/cm3 Compatibility It removes organo-metal oxides from: Metals: no attack on Al, Cu, Ti, TiN, W, Ni Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details. Main Features Unmatched PER cleaning versatility High efficiency at low temperature No intermediary rinse Low environmental impact (fluoride, amine, hydroxylamine and catechol free) Cost efficiency Further Information MSDS: Safety Data Sheet TechniClean™CA25 (MOS) english Sicherheitsdatenblatt TechniClean™CA25 (MOS) german TDS: Technical Data Sheet TechniClean™CA25 (MOS) english Specs: Specs TechniClean™CA25 (MOS) Application Notes: Photoresist Removal english Fotolack entfernen german Further Information about Processing

TechniStrip® Micro D2 Remover with high metal and material compatibility   General Information TechniStrip® Micro D2 is a versatile stripper which is dedicated to address resin lift off and dissolution on negative and positive tone resist. The organic mixture has the particularity to offer high metal and material compatibility allowing to be used on all stacks and particularly on sensitive substrates. TechniStrip® Micro D2 is a very well suited substitute for the NMP and DMSO/Amine strippers, that are regarded as toxic since a while, or which are corrosive to some metals. Product Properties Flashpoint: 87°C Water Solubility: Fully miscible Boiling point: 190°C Density (at 20°C): 1.113 g/cm3 Compatibility Metals: no attack on Al, Cu, Ni, Ta, TaN, Ti, TiN, TiW, Au, Ag, Sn Substrates: SiO2, Si Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details. Some Applications Positive resin stripping Negative tone resist lift off Lift off process to pattern metals and dielectric layers Reworking Adhesive, glue cleaner Further Information MSDS: Safety Data TechniStrip Micro D2 (VLSI) english Sicherheitsdatenblatt TechniStrip Micro D2 (VLSI) german TDS: Technical Data Sheet TechniStrip Micro D2 (VLSI) english Specs: Specs TechniStrip Micro D2 (VLSI) Application Notes: Photoresist Removal english Fotolack entfernen german Further Information about Processing

TechniStrip Micro D350 DMSO-based Stripper   General Information TechniStrip® Micro D350 is a DMSO-based stripper and is a very well suited non-toxic substitute for the NMP that is regarded as toxic since a while. As a stripper or as lift off media, TechniStrip® Micro D350 can be regarded as a non toxic alternative to NMP. Mixtures with Cyclopentanone or with MEK even increase the strip performance of this product. NOTE: The solvent TechniStrip® Micro D350 has a melting point just below room temperature, so it can possi¬bly freeze in storage in cooler rooms. Thawing may require several days, but afterwards the product can still be used as it is. For more details please download the info letter. Further Information MSDS: Safety Data Sheet TechniStrip Micro D350 (ULSI) english Sicherheitsdatenblatt TechniStrip Micro D350 (ULSI) german TDS: Technical Data Sheet TechniStrip Micro D350 (ULSI) english Specs: Specs TechniStrip Micro D350 (ULSI) Application Notes: Photoresist Removal english Fotolack entfernen german Further Information about Processing

TechniStrip® MLO07 DMSO-based Stripper   General Information TechniStrip® MLO 07 is a highly efficient positive and negative tone photoresist remover used for IR, III/V, MEMS, Photonic, TSV mask, solder bumping and hard disk stripping applications. TechniStrip® MLO 07 is developed to address high dissolution performance and high material compatibility on Cu, Al, Sn/Ag, Alu¬mina and common organic substrates. Product Properties Flashpoint: 94°C Water Solubility: Fully miscible Boiling point: 189°C Density (at 20°C): 1.093 g/cm3 Compatibility Metals: no attack on Al, Cu, Ni, Ta, TaN, Ti, TiN, TiW, Au, Ag, Sn Substrates: Si, SiO2 Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details. Main Features Improved performance over NMP in many applications Provides dissolution for many positive resists High material compatibility on Cu, Al, Sn, Ag, alumina, magnetic alloys and organic substrates Ideally suited for gold and aluminum metal lift-off Formulated to minimize the formation of metal fragments during the lift-off process Some Applications Metal Lift-Off Process Further Information MSDS: Safety Data Sheet TechniStrip MLO-07 (MOS) english Sicherheitsdatenblatt TechniStrip MLO-07 (MOS) german TDS: Technical Data Sheet TechniStrip MLO-07 (MOS) english Specs: Specs TechniStrip MLO-07 (MOS) Application Notes: Photoresist Removal english Fotolack entfernen german Further Information about Processing

TechniStrip™ NF26 Dry Film Remover   General Information TechniStrip™ NF26 is a highly effective negative tone photoresist remover used mainly for TSV mask and solder bumping applications. Developed to address laminated photo-resins (dry-film resists) and liquid resins, the novel cleaning formulation TMAH-based showed high dissolution performance compared to standard TMAH-based blends. Additional advantages of the TechniStrip™ NF26 are its very high material compatibility compared to standard TMAH-based solutions. The intrinsic nature of the additives and solvent make the blend totally compatible with metals used throughout the BEOL interconnects to WLP bumping applications. Product Properties Flashpoint: 90°C Viscosity (20°C): < 2cP Water Solubility: Totally miscible Boiling point: 189°C Density (at 20°C): 1.02 g/cm3 Compatibility Metals: no attack on Al, Cu, Ni, Ta, TaN, Ti, TiN, TiW, Ag, Sn Substrates: Si, SiO2 Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details. Main Features Very high stripping rate, > 10µm/min Great resin dissolution efficiency of dry film Bath life up to 72 hours @ 70°C Total metal compatibility, < 2 A/min @ 60°C Complete water miscibility Further Information MSDS: Safety Data Sheet TechniStrip NF26 (MOS) english Sicherheitsdatenblatt TechniStrip NF26 (MOS) german TDS: Technical Data Sheet TechniStrip NF26 (MOS) english Specs: Specs TechniStrip NF26 (MOS) Application Notes: Photoresist Removal english Fotolack entfernen german Further Information about Processing

TechniStrip™ NF52 Highly Effective Remover   General Information TechniStrip™ NF52 is a highly effective remover for negative resists (liquid resists as well as dry films). The intrinsic nature of the additives and solvent make the blend totally compatible with metals used throughout the BEOL interconnects to WLP bumping applications. Product Properties Flashpoint: 90°C Viscosity (20°C): < 2cP Water Solubility: Totally miscible Boiling point: 189°C Density (at 20°C): 1.08 g/cm3 Compatibility Metals: no attack on Al, Cu, Ni, Ta, TaN, Ti, TiN, TiW, Ag, Sn Substrates: Si, SiO2 Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details. Main Features Very high stripping rate, >10µm/min Great resin dissolution efficiency of dry film Bath life up to 72 hours @ 70°C Total metal compatibility, <2A/min @60°C Complete water miscibility Further Information MSDS: Safety Data Sheet TechniStrip NF52 (MOS) english Sicherheitsdatenblatt TechniStrip NF52 (MOS) german TDS: Technical Data Sheet TechniStrip NF52 (MOS) english Specs: Specs TechniStrip NF52 (MOS) Application Notes: Photoresist Removal english Fotolack entfernen german Further Information about Processing

TechniStrip® NI555 Stripper   General Information TechniStrip® NI555 was developed to address fast and complete photoresist film dissolution thus avoiding filter clogging and subsequent insoluble resin debris deposition encountered with most of standard stripping solutions. A cross-linked AZ® 15 nXT film peels from the substrate in DMSO-, NMP- or TMAH-based strippers, while TechniStrip® NI555 completely dissolves the resist film after 20 minutes. Product Properties Flashpoint: 89°C Water Solubility: Totally miscible Boiling point: 190°C Density (at 20°C): 0.978 g/cm3 Compatibility TechniStrip® NI555 is a powerful remover for Novolak-based negative resists and ultrathick positive resists such as: AZ® nLOF200 series AZ® 15nXT AZ® 40XT NOTE: Please note that the TechniStrip® NI555 is not compatible with GaAs**, which can cause problems in the application. Metals: attacked GaAs Metals: no attack on Al, Cu, Ni, Ta, TaN, Ti, TiN, TiW, Au, Ag, Sn, Pd Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details. Further Information MSDS: Safety Data Sheet TechniStrip NI555 (MOS) english Sicherheitsdatenblatt TechniStrip NI555 (MOS) german TDS: Technical Data Sheet TechniStrip NI555 (MOS) english Specs: Specs TechniStrip NI555 (MOS) Application Notes: Photoresist Removal english Fotolack entfernen german Further Information about Processing

TechniStrip® P1316 High Performance Remover   General Information TechniStrip® P1316 is a remover with very strong stripping power for Novolak-based resists (including all AZ® positive resists), epoxy-based coatings, polyimides and dry films. At a typical application temperatures around 75°C TechniStrip® P1316 may dissolve cross-linked resists without residue also, e.g. through dry etching or ion implantation. The remover can also be used in spraying processes. Product Properties Flashpoint: 93°C Viscosity (20°C): < 2 cP Water Solubility: Totally miscible Boiling point: 189°C Density (at 20°C): 1.03 g/cm3 Compatibility Metals: attacked Al, Cu, Au Metals: no attack on Ta, Ni, Ti, TiN Substrates: Si, SiO2 Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details. Some Applications TechniStrip® P1316 is a powerful NMP-free remover for: Novolak-based positive resists such as all positive AZ® resists Epoxy-based resists Polyimides, bonding glues Dry films Further Information MSDS: Safety Data Sheet TechniStrip P1316 (MOS) english Sicherheitsdatenblatt TechniStrip P1316 (MOS) german TDS: Technical Data Sheet TechniStrip P1316 (MOS) english Specs: Specs TechniStrip P1316 (MOS) Application Notes: Photoresist Removal english Fotolack entfernen german Further Information about Processing

TechniStrip® P1331 High Performance Remover   General Information TechniStrip® P1331 is a remover with very strong stripping power for Novolak-based resists (including all AZ® positive resists), epoxy-based coatings, polyimides and dry films. At a typical application temperatures around 75°C TechniStrip® P1331 may dissolve cross-linked resists without residue also, e.g. through dry etching or ion implantation. The remover can also be used in spraying processes. TechniStrip® P1331 is, for alkaline sensitive materials, an alternative to the P1316. Product Properties Flashpoint: 100,5°C Viscosity (20°C): < 2 cP Water Solubility: Totally miscible Boiling point: 189°C Density (at 20°C): 1.109 g/cm3 Compatibility Metals: attacked Al, Cu, Au Metals: no attack on Ta, Ni, Ti, TiN Substrates: Si, SiO2 Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details. Main Features Very high stripping rate, >10µm/min Great resin dissolution efficiency Enhanced resin loading capacity, > 2 times to standard POR THB121N, 21µm, 8” wafer- up to 15 wafers/liter Bath life up to 72 hours @ 70°C Total metal compatibility, <10A/min @60°C Complete water miscibility Safety: labeled irritant Some Applications TechniStrip® P1316 is a powerful NMP-free remover for: Novolak-based positive resists such as all positive AZ® resists Epoxy-based resists Polyimides, bonding glues Dry films Further Information MSDS: Safety Data Sheet TechniStrip P1331 (MOS) english Sicherheitsdatenblatt TechniStrip P1331 (MOS) german TDS: Technical Data Sheet TechniStrip P1331 (MOS) english Specs: Specs TechniStrip P1331 (MOS) Application Notes: Photoresist Removal english Fotolack entfernen german Further Information about Processing