AZ® P4K-AP Protective Coating   General Information AZ® P4K-AP is a cost-effective coating for the protection of device surfaces during operations such as back-lap or backside etch. It is based on Novolak resin and is resistant to most etchants. The thickness of this coating is 6.8 µm at 4000 rpm spin speed. Please note, that the protective coating AZ® P4K-AP is not stable in KOH-etches typically used for silicon etching. Product Properties AZ® P4K-AP is a blend of resin and solvent components typical of fully formulated photoresists. The AZ® P4K-AP Protective Coating excludes the photoactive component of a fully formulated photoresist, thus removing material and QA related costs for applications where photolithographic performance in unnecessary. AZ® P4K-AP uses the same base materials as the industry standard AZ® P4620 photoresist. It offers: Superior adhesion to a wide variety of substrates Compatible with many wet chemistries, both etch and plating Good coating properties Standard photoresist coating processes are used The AZ® P4K-AP can be used in: Dry etch processes Wet etch processes Plating processes The AZ® P4K-AP is removed/stripped in standard wet or dry photoresist removal processes. Developers AZ® P4K-AP is not a photoresist, therefore there is no developer required. Removers AZ® P4K-AP can be removed with all common photoresist strippers such as: Acetone, alkaline solutions, AZ® 100 Remover, DMSO, AZ® 920 Remover and TechniStrip P1316. Thinning/ Edge Bead Removal We recommend for thinning and edge bead removal PGMEA and AZ® EBR Solvent. Further Information MSDS: Safety Data Sheet AZ® P4K-AP Photoresist english Sicherheitsdatenblatt AZ® P4K-AP Fotolack german TDS: Technical Data Sheet AZ® P4K-AP Photoresist english Application Notes: Further Information about Photoresist Processing