AZ® 2026 MIF Developer Metal Ion-free Developers   General Information AZ® 300 MIF, AZ® 326 MIF, AZ® 726 MIF and AZ® 2026 MIF Developers are developer formulations with 2.38 % TMAH (tetramethylammoniumhydroxide) in H2O. The AZ® 726 MIF Developer contains additionally a surfactant for better wetting and easy to settle up of puddle development. Additionally to the wetting agent of the AZ® 726 MIF the AZ® 2026 MIF contains a scum remover for complete and scum-free removal of resist layers on the price of a slightly higher dark erosion ratio. However, for our negative resists, such as AZ® nLof 2000 series, AZ® 15nXT series, AZ® 125nXT resists this developer shows outstanding performance. Even for a positive resist like AZ® 10XT resist it significantly reduces t-topping if this problem occurs. AZ® 2033 MIF is 3.00 % TMAH in H2O with surfactants added for fast and homogeneous substrate wetting and further additives for removal of resist residuals (residues in certain lacquer families), but at the cost of a higher dark removal. Compared to the AZ® 2026 MIF, the normality is not 0.26 but 0.33. Thus the development rate is higher with the AZ® 2033 MIF Developer. Further Information MSDS: Safety Data Sheet AZ® 2026 MIF Developer english Sicherheitsdatenblatt AZ® 2026 MIF Developer deutsch TDS: Technical Data Sheet AZ® 2026 MIF Developer english Application Notes: Development of Photoresist english Entwicklung von Fotolack deutsch

AZ® 2033 MIF Developer Metal Ion-free Developers   General Information AZ® 300 MIF, AZ® 326 MIF, AZ® 726 MIF and AZ® 2026 MIF Developers are developer formulations with 2.38 % TMAH (tetramethylammoniumhydroxide) in H2O. The AZ® 726 MIF Developer contains additionally a surfactant for better wetting and easy to settle up of puddle development. Additionally to the wetting agent of the AZ® 726 MIF the AZ® 2026 MIF contains a scum remover for complete and scum-free removal of resist layers on the price of a slightly higher dark erosion ratio. However, for our negative resists, such as AZ® nLof 2000 series, AZ® 15nXT series, AZ® 125nXT resists this developer shows outstanding performance. Even for a positive resist like AZ® 10XT resist it significantly reduces t-topping if this problem occurs. AZ® 2033 MIF is 3.00 % TMAH in H2O with surfactants added for fast and homogeneous substrate wetting and further additives for removal of resist residuals (residues in certain lacquer families), but at the cost of a higher dark removal. Compared to the AZ® 2026 MIF, the normality is not 0.26 but 0.33. Thus the development rate is higher with the AZ® 2033 MIF Developer. Further Information MSDS: Safety Data Sheet AZ® 2033 MIF Developer english Sicherheitsdatenblatt AZ® 2033 MIF Entwickler german TDS: Technical Data Sheet AZ® 2033 MIF Developer english Application Notes: Development of Photoresist english Entwicklung von Fotolack german

AZ® 300 MIF Developer Metal Ion-free Developers   General Information AZ® 300 MIF, AZ® 326 MIF, AZ® 726 MIF and AZ® 2026 MIF Developers are developer formulations with 2.38 % TMAH (tetramethylammoniumhydroxide) in H2O. The AZ® 726 MIF Developer contains additionally a surfactant for better wetting and easy to settle up of puddle development. Additionally to the wetting agent of the AZ® 726 MIF the AZ® 2026 MIF contains a scum remover for complete and scum-free removal of resist layers on the price of a slightly higher dark erosion ratio. However, for our negative resists, such as AZ® nLof 2000 series, AZ® 15nXT series, AZ® 125nXT resists this developer shows outstanding performance. Even for a positive resist like AZ® 10XT resist it significantly reduces t-topping if this problem occurs. AZ® 2033 MIF is 3.00 % TMAH in H2O with surfactants added for fast and homogeneous substrate wetting and further additives for removal of resist residuals (residues in certain lacquer families), but at the cost of a higher dark removal. Compared to the AZ® 2026 MIF, the normality is not 0.26 but 0.33. Thus the development rate is higher with the AZ® 2033 MIF Developer. Further Information MSDS: Safety Data Sheet AZ® 300 MIF Developer english Sicherheitsdatenblatt AZ® 300 MIF Entwickler german TDS: Technical Data Sheet AZ® 300 MIF Developer english Application Notes: Development of Photoresist english Entwicklung von Fotolack german

AZ® 303 Developer Inorganic Developers   General Information AZ® 303 MIC is based on KOH and NaOH and contains strong surfactants. It is designed for positive and aqueous alkaline compatible negative resists, it can be used for AZ® nLof 20XX series resists as well and is the only one TMAH free developer for this resist. AZ® 303 Developer is typically diluted 1:5 - 1:10 with water. Further Information MSDS: Safety Data Sheet AZ® 303 Developer english Sicherheitsdatenblatt AZ® 303 Entwickler german TDS: Technical Data Sheet AZ® 303 Developer english Application Notes: Development of Photoresist english Entwicklung von Fotolack german

AZ® 326 MIF Developer Metal Ion-free Developers   General Information AZ® 300 MIF, AZ® 326 MIF, AZ® 726 MIF and AZ® 2026 MIF Developers are developer formulations with 2.38 % TMAH (tetramethylammoniumhydroxide) in H2O. The AZ® 726 MIF Developer contains additionally a surfactant for better wetting and easy to settle up of puddle development. Additionally to the wetting agent of the AZ® 726 MIF the AZ® 2026 MIF contains a scum remover for complete and scum-free removal of resist layers on the price of a slightly higher dark erosion ratio. However, for our negative resists, such as AZ® nLof 2000 series, AZ® 15nXT series, AZ® 125nXT resists this developer shows outstanding performance. Even for a positive resist like AZ® 10XT resist it significantly reduces t-topping if this problem occurs. AZ® 2033 MIF is 3.00 % TMAH in H2O with surfactants added for fast and homogeneous substrate wetting and further additives for removal of resist residuals (residues in certain lacquer families), but at the cost of a higher dark removal. Compared to the AZ® 2026 MIF, the normality is not 0.26 but 0.33. Thus the development rate is higher with the AZ® 2033 MIF Developer. Further Information MSDS: Safety Data Sheet AZ® 326 MIF Developer english Sicherheitsdatenblatt AZ® 326 MIF Entwickler german TDS: Technical Data Sheet AZ® 326 MIF Developer english Application Notes: Development of Photoresist english Entwicklung von Fotolack german

AZ® 340 Developer Inorganic Developers   General Information AZ® 340 Developer is a high normality sodium based developer concentrate for use in on-site custom dilution applications. This developer concentrate is buffered for extended bath life and stable develop rates in batch processes. Dilute using 1 part AZ® 340 Developer to 4 parts DI water for high contrast processing. Developer normality (and develop rate) may be increased as required by increasing the AZ® 340 Developer to water ratio. Further Information MSDS: Safety Data Sheet AZ® 340 Developer english Sicherheitsdatenblatt AZ® 340 Developer german TDS: Technical Data Sheet AZ® 340 Developer english Application Notes: Development of Photoresist english Entwicklung von Fotolack german

AZ® 351B Developer Inorganic Developers   General Information AZ® 351B Developer is based on buffered NaOH and typically used in a 1:3 to 1:4 dilution (1 part of concentrate and 4 parts of DI-water). 1:3 dilution is the high speed setup while 1:4 will be used for a high contrast setup. It can be used especially for our thinner resist types, such as AZ® 1500 Series resists or image reversal resists such as AZ® 5200E resist series. Further Information MSDS: Safety Data Sheet AZ® 351B Developer english Sicherheitsdatenblatt AZ® 351B Entwickler german TDS: Technical Data Sheet AZ® 351B Developer english Application Notes: Development of Photoresist english Entwicklung von Fotolack german

AZ® 400K Developer 1:4 Inorganic Developers   General Information In addition to the concentrate, a pre-diluted AZ® 400K 1:4 version is now also available, other dilution ratios on request. AZ® 400K MIC Developer is based on buffered KOH and typically used in a 1:3 to 1:4 dilution (1 part of concentrate and 4 parts of DI-water) and can be used especially for our thicker resist types, such as AZ® 4562, AZ® 10XT, and AZ® 40XT. Further Information MSDS: Safety Data Sheet AZ® 400K 1:4 Developer english Sicherheitsdatenblatt AZ® 400K 1:4 Entwickler german TDS: Technical Data Sheet AZ® 400K 1:4 Developer english Information AZ® 400K 1:4 Developer english Application Notes: Development of Photoresist english Entwicklung von Fotolack german

AZ® 400K Developer Inorganic Developers   General Information AZ® 400K MIC is based on buffered KOH and typically used in a 1:3 to 1:4 dilution (1 part of concentrate and 4 parts of DI-water) and can be used especially for our thicker resist types, such as AZ® 4562, AZ® 10XT, and AZ® 40XT. In addition to the concentrate, a pre-diluted AZ® 400K 1:4 version is now also available, other dilution ratios on request. Further Information MSDS: Safety Data Sheet AZ® 400K Developer english Sicherheitsdatenblatt AZ® 400K Entwickler german TDS: Technical Data Sheet AZ® 400K Developer english Information AZ® 400K Developer english Application Notes: Development of Photoresist english Entwicklung von Fotolack german

AZ® 726 MIF Developer Metal Ion-free Developers   General Information AZ® 300 MIF, AZ® 326 MIF, AZ® 726 MIF and AZ® 2026 MIF Developers are developer formulations with 2.38 % TMAH (tetramethylammoniumhydroxide) in H2O. The AZ® 726 MIF Developer contains additionally a surfactant for better wetting and easy to settle up of puddle development. Additionally to the wetting agent of the AZ® 726 MIF the AZ® 2026 MIF contains a scum remover for complete and scum-free removal of resist layers on the price of a slightly higher dark erosion ratio. However, for our negative resists, such as AZ® nLof 2000 series, AZ® 15nXT series, AZ® 125nXT resists this developer shows outstanding performance. Even for a positive resist like AZ® 10XT resist it significantly reduces t-topping if this problem occurs. AZ® 2033 MIF is 3.00 % TMAH in H2O with surfactants added for fast and homogeneous substrate wetting and further additives for removal of resist residuals (residues in certain lacquer families), but at the cost of a higher dark removal. Compared to the AZ® 2026 MIF, the normality is not 0.26 but 0.33. Thus the development rate is higher with the AZ® 2033 MIF Developer. Further Information MSDS: Safety Data Sheet AZ® 726MIF Developer english Sicherheitsdatenblatt AZ® 726MIF Entwickler german TDS: Technical Data Sheet AZ® 726MIF Developer english Application Notes: Development of Photoresist english Entwicklung von Fotolack german

AZ® Developer Inorganic Developers   General Information AZ® Developer is optimized for minimum Al attack. It is an odourless, aqueous, inorganic, alkaline solution, which is compatible with batch and in-line developing processes. It is typically applied 1:1 diluted in DI-H2O for high contrast, or undiluted for a high development rate. The dark erosion of AZ® Developer is slightly higher as compared to other developers. AZ® Developer can be used in combination with most families of AZ® Photoresists (i.e. AZ® 1500, AZ® ECI3000 and AZ® 4500 or AZ® PL177). AZ® Developer displays the lowest aluminium etch rate (it is more or less zero!) of all AZ® Developer - types and is ideal for metal levels. Further Information MSDS: Safety Data Sheet AZ® Developer english Sicherheitsdatenblatt AZ® Developer german TDS: Technical Data Sheet AZ® Developer english Application Notes: Development of Photoresist english Entwicklung von Fotolack german

AZ® Developer 1:1 Inorganic Developers   General Information AZ® Developer 1:1 is a ready-to-use product and is a 1:1 dilution of AZ Developer. The developer is optimized for minimum Al attack. It is an odourless, aqueous, inorganic, alkaline solution, which is compatible with batch and in-line developing processes. AZ® Developer 1:1 is for high contrast. The dark erosion of AZ® Developer 1:1 is slightly higher as compared to other developers. AZ® Developer 1:1 can be used in combination with most families of AZ® Photoresists (i.e. AZ® 1500, AZ® ECI3000 and AZ® 4500 or AZ® PL177). AZ® Developer 1:1 displays the lowest aluminium etch rate (it is more or less zero!) of all AZ® Developer 1:1 types and is ideal for metal levels. Further Information MSDS: Safety Data Sheet AZ® Developer 1:1 english Sicherheitsdatenblatt AZ® Developer 1:1 german TDS: Technical Data Sheet AZ® Developer 1:1 english Application Notes: Development of Photoresist english Entwicklung von Fotolack german