Ammonium hydroxide solution 28-30% - 2.50 l - VLSI - EVE/EUD!
HAMV1025
Ammonia Solution
NH4OH
General Information
Mixed with H2O2, Ammonia is an ingredient of many etching mixtures for metals such as copper, silver or aluminum.
Our Ammonia solution (28 - 30%) is available in VLSI-quality, which is the usual purity grades applied in semiconductor processing and micro-electronics.
Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.
Further Information
MSDS:
Safety Data Sheet Ammonium Hydroxide Solution (VLSI) 28-30% english
Specs:
Specs Ammonium Hydroxide Solution (VLSI) 28-30%
Application Notes:
Wet Etching english
Nasschemisches Ätzen german
AX 100 - 5.00 l
nbtax1005
Bottle size:
5.00 l
AX 100
Activator
General Information
AX 100 is an acidic solution for activating and pretreating seed layers and metallic surfaces for electroplating, on which a direct metallization may cause problems regarding the adhesive strength. This applies e.g. for the electroplating of Au on Ni surfaces or direct electroplating on Ti or TiW layers.
AX 100 activates metallic surfaces before electroplating and allows a better adhesive strength of electroplated layers on metallic surfaces, which tend to oxidation.
Common fields of application are semiconductor fabrication and microsystem technology.
Product Properties
Low or none etch attack on metallic surfaces
Compatible to many materials, e.g. common metals used in electroplating industry
Compatible to resist masking
Not poisonous substance and easy to handle
Moderate operation temperature of about 40°C
Selectivity
AX 100 is compatible/etches selective to following materials:
Resists: common Novolak as masking resist (e.g. AZ® Photoresist)
Metals: no attack on Ni, Ti, TiW, Ta, Cu
Semiconductor materials: Si, SiO2, Si3N4
Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.
Further Information
MSDS:
Safety Data Sheet AX 100 english
Sicherheitsdatenblatt AX 100 german
TDS:
Technical Data Sheet AX 100 english
Application Notes:
Further Information about Processing
Hydrogen peroxide 30% - 2.50 l - VLSI - PERSO+EVE/EUD!
THOV1025
Hydrogene Peroxide
H2O2
General Information
H2O2 is an ingredient of the Piranha-etch, RCA-1 and RCA-2 etching solutions, as well as etching solutions for various III/V-semiconductors.
H2O2 (30%) is available in VLSI-quality, which is the usual purity grades applied in semiconductor processing and micro-electronics.
Further Information
MSDS:
Safety Data Sheet Hydrogen Peroxide 30% (VLSI) english
Sicherheitsdatenblatt Hydrogen Peroxide 30% (VLSI) german
Specs:
Specs Hydrogen Peroxide 30% (VLSI)
Application Notes:
Wet Etching english
Nasschemisches Ätzen german
Further Information about Processing