Acetic Acid CH3COOH   General Information Acetic Acid as surfactant and buffer is a commonly used additive for various etching mixtures. We supply Acetic Acid (99 %) in VLSI-quality, which is the usual purity grades applied in semiconductor processing and micro-electronics. Further Information   MSDS: Safety Data Sheet Acetic Acid (VLSI) 100 % english Sicherheitsdatenblatt Essigsäure (VLSI) 100 % german Specs: Specs Acetic Acid (VLSI) 100 % Application Notes: Wet Etching english Nasschemisch Ätzen german

BOE 7:1 Buffered Oxide Etch   General Information BOE is mainly used for etching glasses, quartz and SiO2 films. We supply BOE 7:1 = buffered hydrofluoric acid (HF : NH4F = 12.5 : 87.5%) in VLSI-quality, which is the usual purity grades applied in semiconductor processing and micro-electronics. NOTE: BOE must be stored and transported above +12.5°C. Below this critical temperature of 12.5°C the material forms particles (little crystals). Since these crystals have a higher density, they will accumulate at the bottom of the bottle and will only be completely re-dissolved when the material is stored at temperatures of 30 - 35°C for some days. After this procedure the crystals should be re-dissolved completely and the BOE can be then used without restrictions. Further Information MSDS: Safety Data Sheet BOE 7:1 (VLSI) english Sicherheitsdatenblatt BOE 7:1 (VLSI) german Specs: Specs BOE 7:1 (VLSI) Application Notes: Wet Etching english Nasschemisches Ätzen german Further Information about Processing

Hydrochloric Acid HCI   General Information Hydrochloric Acid is an ingredient of various etching mixtures for e.g. ITO, Silver and (together with HNO3 as aqua regia) gold. HCl is suited for the removal of oxide films on many metals. Our Hydrochloric Acid (37%) is available in VLSI-quality, which is the usual purity grades applied in semiconductor processing and micro-electronics. NOTE: HCl (hydrogen chloride), is a gas that dissolves very well in water and forms hydrochloric acid in dissolved form. With a molar mass of 36 g / mol, hydrogen chloride is a very small molecule, which means that it can diffuse through polymers very well. For reasons of purity, the hydrochloric acid is filled in HD-PE polymer bottles. In order to protect the bottles from particles and contaminations, these bottles (which are intended for the use in clean rooms) are packed in plastic bags. Over the time of storage, however, the hydrogen chloride diffuses through the wall of the bottle, which is made of polymer, and collects in the foil bag. There is air that contains not only carbon dioxide but also water vapor and it can react with the hydrogen chloride, whereby either a white dust or fine droplets can be found in the foil bag. This happens during storage even if there is not the slightest leak in the bottles. This white dust or the possible fine droplets are the reason why the 37% hydrochlo¬ric acid, unlike e.g. sulfuric acid of the same degree of purity, has not a shelf life of 3 years, but is only „durable“ for 1 year. It is therefore not the reason that the acid would not maintain its purity or its properties, but rather the label and also the bottles or foil bags are increasingly affected by the problem described above in the course of storage. Further Information MSDS: Safety Data Sheet Hydrochloric Acid 37% (VLSI) english Sicherheitsdatenblatt Salzsäure 37% (VLSI) german Specs: Specs Hydrochloric Acid 37% (VLSI) Application Notes: Wet Etching english Nasschemisches Ätzen german Further Information about Processing

Hydrofluoric Acid HF   General Information Hydrofluoric Acid is mainly used for etching glasses, quartz and SiO2 films as well as (mixed with HNO3) for isotropic silicon etching. We supply hydrofluoric acid (1%, 10% and 50%) in VLSI-quality, which is the usual purity grades applied in semiconductor processing and micro-electronics. Further Information MSDS: Safety Data Sheet Hydrofluoric Acid 1% (VLSI) english Sicherheitsdatenblatt Hydrofluoric Acid 1% (VLSI) german Safety Data Sheet Hydrofluoric Acid 10% (VLSI) english Sicherheitsdatenblatt Hydrofluoric Acid 10% (VLSI) german Safety Data Sheet Hydrofluoric Acid 50% (VLSI) english Sicherheitsdatenblatt Hydrofluoric Acid 50% (VLSI) german Specs: Specs Hydrofluoric Acid 1% (VLSI) Specs Hydrofluoric Acid 10% (VLSI) Specs Hydrofluoric Acid 50% (VLSI) Application Notes: Wet Etching english Nasschemisches Ätzen german Further Information about Processing

Hydrogene Peroxide H2O2   General Information H2O2 is an ingredient of the Piranha-etch, RCA-1 and RCA-2 etching solutions, as well as etching solutions for various III/V-semiconductors. H2O2 (30%) is available in VLSI-quality, which is the usual purity grades applied in semiconductor processing and micro-electronics. Further Information MSDS: Safety Data Sheet Hydrogen Peroxide 30% (VLSI) english Sicherheitsdatenblatt Hydrogen Peroxide 30% (VLSI) german Specs: Specs Hydrogen Peroxide 30% (VLSI) Application Notes: Wet Etching english Nasschemisches Ätzen german Further Information about Processing

Nitric Acid HNO3   General Information Nitric Acid is the oxidizing ingredient of many etching mixtures for e.g. Silver, Copper, Aluminium, Silicon, Germanium and (together with HCl as aqua regia) Gold. We supply Nitric Acid (69%) in VLSI-quality, which is the usual purity grades applied in semiconductor processing and micro-electronics. Further Information MSDS: Safety Data Sheet Nitric Acid 69,5% (VLSI) english Sicherheitsdatenblatt Nitric Acid 69,5% (VLSI) german Specs: Specs Nitric Acid 69,5% (VLSI) Application Notes: Wet Etching english Nasschemisches Ätzen german Further Information about Processing

Phosphoric Acid H3PO4   General Information Phosphoric Acid mixed with HNO3 is an ingredient of many etching mixtures for e.g. Aluminium and many other metals. We supply Phosphoric Acid (85%) in VLSI-quality, which is the usual purity grades applied in semiconductor processing and micro-electronics. Further Information MSDS: Safety Data Sheet Phosphoric Acid 85% (VLSI) english Sicherheitsdatenblatt Phosphoric Acid 85% (VLSI) german Specs: Specs Phosphoric Acid 85% (VLSI) Application Notes: Wet Etching english Nasschemisches Ätzen german Further Information about Processing

Sulfuric Acid H2SO4   General Information A mixture of Sulfuric Acid with H2O2 is a powerful stripper for organic impurities or residuals on substrates. We supply Sulfuric Acid (96%) in VLSI-quality, which is the usual purity grades applied in semiconductor processing and micro-electronics. Further Information MSDS: Safety Data Sheet Sulfuric Acid 96% (VLSI) english Sicherheitsdatenblatt Sulfuric Acid 96% (VLSI) german Specs: Specs Sulfuric Acid 96% (VLSI) Application Notes: Wet Etching english Nasschemisches Ätzen german Further Information about Processing