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Quartz wafer 3 inch 500 um Y-Cut DSP

Quartz wafer 500 µm Y-Cut

Product information "Quartz wafer 3 inch 500 um Y-Cut DSP"

Quartz wafer 3 inch, thickness = 500 ± 25 µm, Y-Cut, 2-side polished, TTV < 10 µm, SAW grade, Quality factor Q > 2.4M, Etch channel density ECD < 30, inclusion concentration (ID): I grade