QUARZ WAFER

Diameter and shape

We can offer single crystal quartz wafers with 2, 3 and 4 inch diameter . Unless otherwise stated, "inch" in this context means 25.0 mm for 4 inch and larger wafers, and 25.4 mm for 1 and 2 inch wafers. In addition to round wafers, wafers separated into rectangular pieces are also possible. Due to the high fixed costs of the separation process, it usually only makes economic sense to order quantities that correspond to the separation of approx. 10 initial wafers. However, we also occasionally keep smaller quantities of frequently requested separated wafers in stock.

Orientation and thickness

We can offer quartz wafers in the crystal orientations X-cut, Y-cut, Z-cut, AT-cut and ST-cut, among others; common wafer thicknesses are 200 μm, 500 μm, 700 mm and 1000 μm. We are happy to check the availability of other crystal orientations and thicknesses on request.

Surface

Quartz wafers are usually polished on both sides, for certain applications also on one side. The roughness is usually specified as "< 1.5 nm" or "< 1.0 nm". As with Si wafers, even the finest polishing marks define the surface quality of the polished side(s), which is defined by the size S/D (usually 40/20).

Production of quartz wafers

The starting material

The starting material for growing quartz single crystals are naturally occurring, high-purity quartz crystals (so-called "lascas"), which can be used in cm-sized fragments without further purification for the crystal growing process described in the following section.

Crystal growing

Single crystals of quartz are produced synthetically according to the hydrothermal principle (Fig. below). In this process, quartz crystallises at a temperature of around 400°C and a pressure of approx. 1000 - 1500 bar from a saturated NaOH solution on quartz seed crystals that are at a slightly lower temperature than the quartz pieces, which are continuously dissolved as starting material. Crystal growth can take hours to days, with the resulting single crystals weighing up to several kg.

Growing quartz single crystals according to the hydrothermal principle.

Further Information:

> Application areas and compatibilities
> Image Reversal Resist Processing

Details

Quartz wafer 1 inch 500 um Z-Cut DSP

WQC10500200X0000XNN1

Quartz wafer 1 inch, thickness = 500 ± 20 µm, Z-Cut, 2-side polished, no flat, packaging units of 25 wafers

From €14.00*

Details

Quartz wafer 2 inch 200 um Y-Cut DSP

WQB20200250X0000SNN1

Quartz wafer 2 inch (50.8 mm), Y-cut, thickness = 200 ± 25 µm, Y-Cut, 2-side polished, seedless, 1 SEMI Flat

From €31.00*

Details

Quartz wafer 2 inch 700 um ST-Cut DSP

WQL20700250XXXXXSNN1

Quartz wafer 2 inch, thickness = 700 ± 25 µm, ST-Cut, 2-side polished, TTV < 10 µm, 1 SEMI Flat

From €17.00*

Details

Quartz wafer 3 inch 1000 um Z-Cut DSP

WQC31000250X0000SNN1

Quartz wafer 3 inch, thickness = 1000 ± 25 µm, Z-Cut, 2-side polished, TTV < 10 µm, 1 SEMI Flat

From €33.00*

Details

Quartz wafer 3 inch 1000 um Z-Cut DSP

WQC31000251X0000XNN1

Quartz wafer 3 inch, thickness = 1000 ± 25 µm, Z-Cut, 2-side polished, TTV < 1 µm, Ra<0.5 nm, no flat

From €48.00*

Details

Quartz wafer 3 inch 1000 um Z-Cut DSP

WQC31000252X0000XNN1

Quartz wafer 3 inch, thickness = 1000 ± 25 µm, Z-Cut, 2-side polished, TTV < 2 µm, Ra<0.5 nm, no flat

From €48.00*

Details

Quartz wafer 3 inch 200 um Z-Cut DSP

WQC30200250X0000SNN1

Quartz wafer 3 inch, thickness = 200 ± 25 µm, Z-Cut, 2-side polished, TTV < 10 µm, 1 SEMI Flat

From €29.00*

Details

Quartz wafer 3 inch 500 um Y-Cut DSP

WQB30500250XXXXXSNN1

Quartz wafer 3 inch, thickness = 500 ± 25 µm, Y-Cut, 2-side polished, TTV < 10 µm, SAW grade, Quality factor Q > 2.4M, Etch channel density ECD < 30, inclusion concentration (ID): I grade

From €41.00*