OTHER ETCHING CHEMICALS
In addition to the standard etching chemicals, we also stock a few substances with special properties that are required for special applications and processes.
Further information
> Wet chemical etching: Basics
> Wet chemical etching of Al, Au, Cu, Cr, Ni, Ti and Ag
> Wet chemical etching of silicon
> Dry etching
Ammonium hydroxide solution 28-30% - 2.50 l - VLSI - EVE/EUD!
HAMV1025
Ammonia Solution
NH4OH
General Information
Mixed with H2O2, Ammonia is an ingredient of many etching mixtures for metals such as copper, silver or aluminum.
Our Ammonia solution (28 - 30%) is available in VLSI-quality, which is the usual purity grades applied in semiconductor processing and micro-electronics.
Data on selectivity and compatibility are manufacturer information and do not claim to be complete. Please contact us for further details.
Further Information
MSDS:
Safety Data Sheet Ammonium Hydroxide Solution (VLSI) 28-30% english
Specs:
Specs Ammonium Hydroxide Solution (VLSI) 28-30%
Application Notes:
Wet Etching english
Nasschemisches Ätzen german
Hydrogen peroxide 30% - 2.50 l - VLSI - PERSO+EVE/EUD!
THOV1025
Hydrogene Peroxide
H2O2
General Information
H2O2 is an ingredient of the Piranha-etch, RCA-1 and RCA-2 etching solutions, as well as etching solutions for various III/V-semiconductors.
H2O2 (30%) is available in VLSI-quality, which is the usual purity grades applied in semiconductor processing and micro-electronics.
Further Information
MSDS:
Safety Data Sheet Hydrogen Peroxide 30% (VLSI) english
Sicherheitsdatenblatt Hydrogen Peroxide 30% (VLSI) german
Specs:
Specs Hydrogen Peroxide 30% (VLSI)
Application Notes:
Wet Etching english
Nasschemisches Ätzen german
Further Information about Processing