MicroChemicals GmbH

MC-Dip-Coating Resist - 5.00 l

MC Dip Coating Resist is a positive tone optimized for Dip Coating application.
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Product number: 1dip050
Manufacturer: MicroChemicals GmbH
Product information "MC-Dip-Coating Resist - 5.00 l"

MC Dip Coating

Resist for Dip Coating

 

General Information

The MC Dip Coating Resist is a positive tone, ready-to-use (ready-diluted), low-cost resist, optimized for dip coating application with improved large-scale resist film thickness homogeneity.

Product Properties

MC Dip Coating Resist is a low-cost, ready-to-use (ready-diluted), positive tone resist optimized for dip coating with improved large-scale resist film thickness homogeneity. Its dye allows a fast and easy visual inspection on the coating performance. The attainable resist film thickness range is approx. 2 - 10 µm at a pull velocity of 3 - 15 mm/s. MC Dip Coating Resist contains two solvents: The low-boiling MEK causes a fast pre-drying of the resist film thus preventing resist flowing towards the bottom of the substrate (panels) to be coated. The high-boiling (= slowly evaporating) PGMEA yields a very smooth resist film surface.

Dip Coating

A pull velocity of 5 - 8 mm/s is recommended for a high coating homogeneity. Between the dip coating steps, it is recommended to cover the tank in order to prevent the evaporation of MEK and the incorporation of particles into the liquid resist. After coating, few minutes delay at room temperature will allow the resist film to smoothen.

Developers

We recommend the developers AZ® Developer, AZ® 400K and AZ® 351B also possible are simple NaOH, KOH and TMAH solutions.

Resist Removal

Alkaline strippers such as AZ® 100 Remover, or an approx. 3 % aqueous KOH- or NaOH-solution will work. Many organic solvents are also suited for photoresist removal.

Further Information

MSDS:
Safety Data Sheet MC Dip Coating Resist english
Sicherheitsdatenblatt MC Dip Coating Resist german

TDS:
Technical Data Sheet MC Dip Coating Resist english

Application Notes:
Further Information about Photoresist Processing

Chemically amplified: no
Film thickness: 2 – 10 µm
Film thickness range: medium (1.6 - 5.0µm), thick (> 5.1µm)
High thermal stability: no
Mode: positive
Optimized for: dip coating, wet etching