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Fused silica wafer 4 inch 500 um DSP

Fused Silica wafer 500 µm

Product information "Fused silica wafer 4 inch 500 um DSP"

Fused silica JGS1 wafer 4 inch, thickness = 500 ± 25 µm, 2-side polished, primary flat 32.5 +/- 2 mm

Diameter (round): 4 inch
Material: Fused Silica
Surface: 2-side polished
Thickness: 401 - 500 µm