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Fused silica wafer 4 inch 250 um DSP

Fused Silica wafer 250 µm

Product information "Fused silica wafer 4 inch 250 um DSP"

Fused silica JGS2 wafer 4 inch, thickness = 250 ± 25 µm, 2-side polished

Diameter (round): 4 inch
Material: Fused Silica
Surface: 2-side polished
Thickness: 201 - 300 µm