Fused silica wafer 3 inch 500 um DSP
Fused Silica wafer 500 µm
€8.00*
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Product number:
WUS30500250X0000SNN4
Product information "Fused silica wafer 3 inch 500 um DSP"
Dummy Fused silica JGS2 wafer 3 inch, thickness = 500 ± 25 µm, 2-side polished, TTV < 10 µm, roughness Ra < 1 nm, not particle specified (box already opened)
| Diameter (round): | 3 inch |
|---|---|
| Material: | Fused Silica |
| Surface: | 2-side polished |
| Thickness: | 401 - 500 µm |