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Fused silica wafer 25 x 25 mm 500 um DSP

Fused Silica wafer 500 µm

Product information "Fused silica wafer 25 x 25 mm 500 um DSP"

Fused silica JGS1 wafer piece (25 x 25 mm), thickness = 500 ± 25 µm, 2-side polished, packed in units of 25 pieces

Material: Fused Silica
Rectangular Size: 21 - 50 mm
Surface: 2-side polished
Thickness: 401 - 500 µm