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Fused silica wafer 20 x 20 mm 250 um DSP

Fused Silica wafer 250 µm

Product information "Fused silica wafer 20 x 20 mm 250 um DSP"

Fused silica JGS2 wafer piece (20 x 20 mm), thickness = 250 ± 25 µm, 2-side polished, units of 50 pieces

Material: Fused Silica
Rectangular Size: 11 - 20 mm
Surface: 2-side polished
Thickness: 201 - 300 µm