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Fused silica JGS2 wafer 8 x 7 mm 170 um DSP

Fused Silica wafer 170 µm

Product information "Fused silica JGS2 wafer 8 x 7 mm 170 um DSP"

Fused silica JGS2 wafer piece (8 x 7 mm), thickness = 170 ± 20 µm, 2-side polished

Material: Fused Silica
Rectangular Size: 6 - 10 mm
Surface: 2-side polished
Thickness: 100 - 200 µm