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Fused silica JGS2 wafer 6 inch 700 um DSP

Fused Silica wafer 700 µm

Product information "Fused silica JGS2 wafer 6 inch 700 um DSP"

Fused silica JGS2 wafer 6 inch, thickness = 700 ± 25 µm, 2-side polished, TTV < 10 µm, S/D 40/20, Bow < 25 µm, Warp < 30 µm, 1 SEMI Flat