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Fused silica JGS2 wafer 50 x 50 mm 300 um DSP

Fused Silica wafer 300 µm

Product information "Fused silica JGS2 wafer 50 x 50 mm 300 um DSP"

Fused silica JGS2 wafer piece (50 x 50 mm +/- 0.3 mm), thickness = 300 ± 25 µm, 2-side polished, packed in units of 25 wafers