Fused silica JGS2 wafer 50 x 50 mm 300 um DSP
Fused Silica wafer 300 µm
| Quantity | Unit price |
|---|---|
| To 49 |
€8.50*
|
| To 99 |
€7.00*
|
| To 199 |
€6.60*
|
| From 200 |
€6.40*
|
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Product number:
W9US0500500300NNNNX1
Product information "Fused silica JGS2 wafer 50 x 50 mm 300 um DSP"
Fused silica JGS2 wafer piece (50 x 50 mm +/- 0.3 mm), thickness = 300 ± 25 µm, 2-side polished, packed in units of 25 wafers
| Material: | Fused Silica |
|---|---|
| Rectangular Size: | 21 - 50 mm |
| Surface: | 2-side polished |
| Thickness: | 201 - 300 µm |