Fused silica JGS2 wafer 4 inch 350 um DSP
Fused Silica wafer 350 µm
| Quantity | Unit price |
|---|---|
| To 4 |
€43.80*
|
| To 9 |
€33.00*
|
| To 24 |
€27.40*
|
| To 49 |
€21.80*
|
| To 99 |
€21.20*
|
| To 199 |
€20.80*
|
| From 200 |
€20.20*
|
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Product number:
WUS40350250XXXXXXNN1
Product information "Fused silica JGS2 wafer 4 inch 350 um DSP"
Fused silica JGS2 wafer 4 inch, thickness = 350 ± 25 µm, 2-side polished, TTV < 10 µm, 1 SEMI Flat
| Diameter (round): | 4 inch |
|---|---|
| Material: | Fused Silica |
| Surface: | 2-side polished |
| Thickness: | 301 - 400 µm |