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Fused silica JGS2 wafer 4 inch 1000 um DSP

Fused Silica wafer 1000 µm

Product information "Fused silica JGS2 wafer 4 inch 1000 um DSP"

Fused silica JGS2 wafer 4 inch +/- 0.2 mm, thickness = 1000 ± 25 µm, 2-side polished, TTV < 10 µm, primary flat 32.50mm +/- 2.50 mm, OH content < 300 ppm