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Fused silica JGS2 wafer 35 x 35 mm 700 um DSP

Fused Silica wafer 700 µm

Product information "Fused silica JGS2 wafer 35 x 35 mm 700 um DSP"

Fused silica JGS2 wafer piece (35 x 35 mm), thickness = 700 ± 25 µm, 2-side polished, units of 20 pieces in PE film packaging

Material: Fused Silica
Rectangular Size: 21 - 50 mm
Surface: 2-side polished
Thickness: 501 - 700 µm