Fused silica JGS2 wafer 3 inch 500 um DSP
Fused Silica wafer 500 µm
| Quantity | Unit price |
|---|---|
| To 4 |
€34.50*
|
| To 9 |
€24.80*
|
| To 24 |
€20.00*
|
| To 49 |
€15.00*
|
| To 99 |
€14.00*
|
| To 299 |
€13.00*
|
| To 999 |
€12.00*
|
| From 1000 |
€11.00*
|
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Product number:
WUS30500250X0000SNN2
Product information "Fused silica JGS2 wafer 3 inch 500 um DSP"
Fused silica JGS2 wafer 3 inch, thickness = 500 ± 25 µm, 2-side polished, TTV < 10 µm, roughness Ra < 1 nm, 1 Flat (22.5+/-2.5mm)
| Diameter (round): | 3 inch |
|---|---|
| Material: | Fused Silica |
| Surface: | 2-side polished |
| Thickness: | 401 - 500 µm |