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Fused silica JGS2 wafer 3 inch 500 um DSP

Fused Silica wafer 500 µm

Product information "Fused silica JGS2 wafer 3 inch 500 um DSP"

Fused silica JGS2 wafer 3 inch, thickness = 500 ± 25 µm, 2-side polished, TTV < 10 µm, roughness Ra < 1 nm, 1 Flat (22.5+/-2.5mm)