Skip to main content

Fused silica JGS2 wafer 2 inch 500 um DSP

Fused Silica wafer 500 µm

Product information "Fused silica JGS2 wafer 2 inch 500 um DSP"

Fused silica JGS2 wafer 2 inch, thickness = 500 ± 25 µm, 2-side polished, TTV < 10 µm, 1 flat