Fused silica JGS2 wafer 2 inch 3600 um DSP
Fused Silica wafer 3600 µm
| Quantity | Unit price |
|---|---|
| To 9 |
€22.00*
|
| To 19 |
€20.00*
|
| To 49 |
€18.00*
|
| To 99 |
€16.00*
|
| From 100 |
€15.00*
|
No longer available - availability check on request
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Product number:
WUS23600500X0000XNN1
Product information "Fused silica JGS2 wafer 2 inch 3600 um DSP"
Fused silica JGS2 wafer 2 inch, thickness = 3600 ± 50 µm, 2-side polished, no flat, film packing, units of 5 wafers per bag
| Diameter (round): | 2 inch |
|---|---|
| Material: | Fused Silica |
| Surface: | 2-side polished |
| Thickness: | > 2000 µm |