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Fused silica JGS2 wafer 100 x 100 mm 200 um DSP

Fused Silica wafer 200 µm

Product information "Fused silica JGS2 wafer 100 x 100 mm 200 um DSP"

Fused silica JGS2 wafer piece (100 x 100 mm), thickness = 200 ± 10 µm, , 2-side polished, TTV < 10 µm, Bow < 40 µm, Warp < 40 µm, S/D 40/20, packed in units of 10 wafers